(Sr.) Process Integration Engineer (m/f/d) – SiC

Nexperia Germany

Job ID: R-20007276 ## What you will do – Develop new wafer process modules for SiC wafers (doping, Laser anneal, CVD, etching, cleaning, characterization) – Execute major process development or integration tasks and build up product and process knowledge – Leader of small or medium size process integration or optimization projects – Sub-project leader of process development or integration tasks in complex projects – Build up and maintain knowledge (technical & procedures) and BG internal & external contacts in own field of expertise – Active member in PC&O Process improvement teams – Provide technical mentorship to less experienced engineers ## What you will need – Master’s degree in Semiconductor Device Physics or Semiconductor Technology and/or Microelectronics – Minimum 3 years’ relevant working experience – Knowledge of semiconductor devices and industrial semiconductor technology – Hands on experience in wafer fab process module developments on furnace equipment – Team player with a strong drive to achieve success – Fluency in German. Good level in English – Willingness to travel internationally (approximately 50% during the first 2 years of service) – Good communication skills, both verbal and in writing ## Why work for us? – Flexible working hours and possibility of overtime reduction to maintain a Work-Life-Balance – Unlimited employment contract with a competitive salary and supplementary voluntary employee benefits – A wide variety of training courses and career development options – Numerous further benefits, such as retirement provisions, travel allowance for the HVV public transport ticket, company events, sports and leisure activities, employee discounts and even more